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this is information on a product in full production. august 2012 doc id 023621 rev 1 1/15 15 TDA7266SAN 5 w + 5 w dual bridge amplifier datasheet ? production data features wide supply voltage range (3.5 - 13 v) minimum external components ? no swr capacitor ? no bootstrap ? no boucherot cells ? internally fixed gain standby & mute functions short-circuit protection thermal overload protection description the TDA7266SAN is a dua l bridge amplifier specifically designed for lcd monitors, pc motherboards, tvs and portable radio applications. the device is pin-to-pin compatible with the tda7266, tda7266sa, tda7297sa and tda7297. table 1. device summary part number package packing TDA7266SAN clipwatt15 tube clipwatt15 www.st.com
contents TDA7266SAN 2/15 doc id 023621 rev 1 contents 1 block diagram and pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 application suggestions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 standby and mute functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4.1 microprocessor application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4.2 low-cost application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5 characterization curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 6 pcb layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7 heatsink dimensioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 8 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 9 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
TDA7266SAN block diagram and pin connections doc id 023621 rev 1 3/15 1 block diagram and pin connections figure 1. block and application diagram figure 2. pin connections (top view) 1 2 4 vref 7 y b - t s in1 0.22 f v cc 13 3 d94au175b + - - + out1+ out1- 15 14 12 6 e t u m in2 0.22 f + - - + out2+ out2- 8 9 s-gnd pw-gnd 470 f 100nf 1 2 3 4 5 6 7 9 10 11 8 n.c. n.c. s-gnd pw-gnd out2+ out2- vcc in2 st-by mute n.c. in1 v cc out1- out1+ d03au1463 13 14 15 12
electrical specifications TDA7266SAN 4/15 doc id 023621 rev 1 2 electrical specifications 2.1 absolute maximum ratings 2.2 thermal data table 2. absolute maximum ratings symbol parameter value unit v s supply voltage 13 v i o output peak current (internally limited) 2 a p tot total power dissipation (t amb = 70 c) 15 w t op operating temperature 0 to 70 c t stg , t j storage and junction temperature -40 to 150 c table 3. thermal data symbol parameter value unit r th j-case thermal resistance junction-ca se typ = 1.8; max = 2.5 c/w r th j-amb thermal resistance junction-ambient 48 c/w
TDA7266SAN electrical characteristics doc id 023621 rev 1 5/15 3 electrical characteristics unless otherwise stated, the values in the table below are given for conditions v cc = 9.5 v, r l = 8 , f = 1 khz, t amb = 25 c. table 4. electrical characteristics symbol parameter test condition min. typ. max unit v cc supply range 3 9.5 13 v i q total quiescent current 50 65 ma v os output offset voltage 120 mv p o output power thd 10% 4.5 5 w thd total harmonic distortion p o = 1 w 0.05 0.2 % p o = 0.1 w to 2 w f = 100 hz to 15 khz 1% svr supply voltage rejection f = 100 hz, vr = 0.5 v 40 56 db ct crosstalk 46 60 db a mute mute attenuation 60 80 db t w thermal threshold 150 c g v closed loop voltage gain 25 26 27 db g v voltage gain matching 0.5 db r i input resistance 25 30 k vt mute mute threshold for v cc > 6.4 v; v o = -30 db 2.3 2.9 4.1 v for v cc < 6.4 v; v o = -30 db v cc /2 - 1 v cc /2 - 0.75 v cc /2 - 0.5 v vt st-by st-by threshold 0.8 1.3 1.8 v i st-by st-by current v6 = gnd 100 a e n total output voltage a curve; f = 20 hz to 20 khz 150 v
application suggestions TDA7266SAN 6/15 doc id 023621 rev 1 4 application suggestions standby and mute functions 4.1 microprocessor application in order to avoid annoying "pop noise" during turn-on/off transients, the correct sequence of the st-by and mute signals must be ensured which is quite simple when using a microprocessor ( figure 3 and 4 ). first the st-by signal (from the microprocessor) goes high and the voltage across the st-by terminal (pin 7) starts to increase exponentially. the external rc network is intended to turn on slowly the biasing circuits of the amplifie r, in order to avoid "pop" and "click" on the outputs. when this voltage reaches the st-by threshold level, the amplifier is switched on, and the external capacitors in series to the input terminals (c3, c53) start to charge. the mute signal must be held low until the capacitors are fully charged, in order to avoid that the device goes in play mode causing a loud "pop noise" on the speakers. a delay of 100 - 200 ms between the st-by and mute signals is suitable for proper operation. figure 3. microprocessor application 1 2 4 vref st-by 7 in1 c1 0.22 f v cc 13 3 d95au258a + - - + out1+ out1- 15 14 12 mute 6 in2 c3 0.22 f + - - + out2+ out2- 8 9 s-gnd pw-gnd c5 470 f c6 100nf r1 10k c2 10 f p r2 10k c4 1 f
TDA7266SAN application suggestions doc id 023621 rev 1 7/15 figure 4. microprocessor driving signals +v s (v) v in (mv) v st-by pin 7 i q (ma) st-by mute play mute st-by 1.8 0.8 v mute pin 6 4.1 2.3 off off d96au259mod v out (v) 2.9 1.3
application suggestions TDA7266SAN 8/15 doc id 023621 rev 1 4.2 low-cost application in low-cost applications where the microprocessor is not present, the recommended circuit is shown in figure 5 . the st-by and mute terminals are tied together and they are connected to the supply line via an external voltage divider. the device is switched on/off from the supply line and the external capacitor c4 is used to delay exceeding the st-by and mute threshold in order to avoid "popping" noise. figure 5. standalone low-cost application 1 2 4 vref st-by 7 in1 c3 0.22 f v cc 13 3 d95au260a + - - + out1+ out1- 15 14 12 mute 6 in2 c5 0.22 f + - - + out2+ out2- 8 9 s-gnd pw-gnd c1 470 f c2 100nf r1 47k c4 10 f r2 47k
TDA7266SAN characterization curves doc id 023621 rev 1 9/15 5 characterization curves figure 6. distortion vs. frequency figure 7. gain vs. frequency 0.010 0.1 1 10 k 0 2 k 0 1 k 1 0 0 1 thd(%) v cc = 9.5 v rl = 8 ohm pout = 100mw pout = 2w fr eque nc y (hz) -5.000 -4.000 -3.000 -2.000 -1.000 0.0 1.0000 2.0000 3.0000 4.0000 5.0000 10 100 1k 10k 100k level(db r) vcc = 9.5 v rl = 8 ohm po ut = 1w fr equenc y (hz) figure 8. mute attenuation vs. vpin 6 figure 9. quiescent current vs. supply voltage 1 1.5 2 2.5 3 3.5 4 4.5 5 0 10 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 attenuation (db) vpin .6(v) 3 4 5 6 7 8 9 101112131415 30 35 40 45 50 55 60 65 70 iq (ma ) vsupp ly (v) figure 10. standby attenutation vs. vpin 7 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 0 10 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 attenuation (db) vpin .7 (v)
pcb layout TDA7266SAN 10/15 doc id 023621 rev 1 6 pcb layout figure 11. reference board component layout figure 12. reference board top layer layout figure 13. reference board bottom layer layout
TDA7266SAN heatsi nk dimensioning doc id 023621 rev 1 11/15 7 heatsink dimensioning in order to avoid triggering the thermal protection which is set approximatively at t j = 150c, it is important to correctly dimension the heat sinker r th (c/w). the parameters that influence the dimensioning are: maximum dissipated power for the device (p dmax ) max. thermal resistance junction to case (r th j-c ) max. ambient temperature t amb max quiescent current i q (ma) example: v cc = 9.5 v, r load = 8 ohm, r th j-c = 2.5 c/w , t amb max = 50 c figure 14 shows the power derating curve for the device. figure 14. power derating curve p dmax n o channels () v cc 2 2 r load 2 ------------- - ? --------------------------- ? i q v cc ? + = p dmax 22.3 () ? 0.47 5.07w = + = heatsinker () r th c a ? 150 t amb max ? p dmax ----------------------------------------- - r th j c ? 150 50 ? 5.07 ---------------------- 2.5 ? ?? ?? 17.2 o c/w = = ? = a) infinite heatsink b) 7 c/ w c) 10 c/ w (c) (a) (b) 0 5 10 15 20 25 04080120160 tamb (c) pd (w) a) infinite heatsink b) 7 c/ w c) 10 c/ w (c) (a) (b) 0 5 10 15 20 25 04080120160 tamb (c) pd (w)
package mechanical data TDA7266SAN 12/15 doc id 023621 rev 1 8 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. clipwatt assembly suggestions the recommended mounting method of the clipwatt on an external heatsink requires the use of a clip placed as close as possible to the center of the plastic body, as indicated in the example of figure 15 . a thermal grease can be used in order to reduce the additional thermal resistance of the contact between the package and heatsink. a force of 7 - 10 kg gives a good contact and the clip must be designed in order to withstand a maximum contact pressure of 15 kg/mm 2 between itself and the plastic body case. for example, if a 15 kg force is applied by the clip on the package, the clip must have a contact area of at least 1 mm 2 . figure 15. example of right placement of the clip
TDA7266SAN package mechanical data doc id 023621 rev 1 13/15 figure 16. clipwatt15 package outline and mechanical data outline and mechanical data 0044538 dim. mm inch min. typ. max. min. typ. max. a 3.2 0.126 b 1.05 0.041 c 0.15 0.006 d 1.55 0.061 e 0.49 0.55 0.019 0.022 f 0.67 0.73 0.026 0.029 g 1.14 1.27 1.4 0.045 0.050 0.055 g1 17.57 17.78 17.91 0.692 0.700 0.705 h1 12 0.480 h2 18.6 0.732 h3 19.85 0.781 l 17.95 0.707 l1 14.45 0.569 l2 10.7 11 11.2 0.421 0.433 0.441 l3 5.5 0.217 m 2.54 0.100 m1 2.54 0.100 clipwatt15 weight: 1.92gr
revision history TDA7266SAN 14/15 doc id 023621 rev 1 9 revision history table 5. document revision history date revision changes 31-aug-2012 1 initial release.
TDA7266SAN doc id 023621 rev 1 15/15 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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